Silicon-agnostic by design
We integrate the right connectivity silicon for each workload, so you are never locked to a single vendor’s roadmap.
Every Betelgeuse board pairs signal-integrity-first hardware with an instrumentation layer that ships in the box.
High-speed-material PCBs, controlled-impedance stack-ups, power delivery, thermal design, and connector/retimer integration engineered around the target silicon.
Meissa firmware provides BMC integration, per-lane link telemetry, bring-up sequencing, and diagnostics over standard management interfaces.
We integrate the right connectivity silicon for each workload, so you are never locked to a single vendor’s roadmap.
At 200G+ per lane and PCIe Gen 6, our SI/PI engineering, materials, and layout discipline are what turn a datasheet into a link that closes.
Manufacturable, thermally-validated, standards-compliant hardware — PCIe CEM, OCP, E3.S, OAM — from schematic to volume.
Built around open standards — PCIe, CXL, Ethernet, UALink, OCP — so your fabric stays interoperable and future-proof.
On-board telemetry, BMC integration, and link diagnostics baked into every design so operators can see and manage the fabric.
Links that close at full rate with margin to spare — verified, not assumed, across temperature and process.
A specialist board team that productizes the newest silicon fast, so you skip building one in-house.
Serviceable, instrumented, standards-compliant hardware that stays deployable across silicon generations.
Retimers, active cables, and interconnect modules that hold signal integrity across boards, risers, and racks.
CXL memory expansion and high-radix switch boards that flatten the scale-up network and grow addressable memory.
Backplanes, trays, and management firmware that turn boards into a deployable, instrumented rack-scale pod.