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Technology

From datasheet
to a link that closes

A connectivity chip is only potential. Turning it into a deployable, rack-scale product is a hardware-and-firmware discipline — and it’s the whole of what we do.

Architecture

Two layers, one integrated product

Every Betelgeuse board pairs signal-integrity-first hardware with an instrumentation layer that ships in the box.

  1. 01

    Board hardware layer

    High-speed-material PCBs, controlled-impedance stack-ups, power delivery, thermal design, and connector/retimer integration engineered around the target silicon.

  2. 02

    Telemetry & management layer

    Meissa firmware provides BMC integration, per-lane link telemetry, bring-up sequencing, and diagnostics over standard management interfaces.

Host / accelerators
Meissa — telemetry & management
BMCRedfishDiagnostics
Betelgeuse board — SI-engineered hardware
RetimerPowerThermal
Connectivity silicon layer
What sets the boards apart

Five commitments in every design

Silicon-agnostic by design

We integrate the right connectivity silicon for each workload, so you are never locked to a single vendor’s roadmap.

Signal integrity is the product

At 200G+ per lane and PCIe Gen 6, our SI/PI engineering, materials, and layout discipline are what turn a datasheet into a link that closes.

Rack-ready, not reference-only

Manufacturable, thermally-validated, standards-compliant hardware — PCIe CEM, OCP, E3.S, OAM — from schematic to volume.

Open ecosystems first

Built around open standards — PCIe, CXL, Ethernet, UALink, OCP — so your fabric stays interoperable and future-proof.

Instrumented from the board up

On-board telemetry, BMC integration, and link diagnostics baked into every design so operators can see and manage the fabric.

Why it matters

What you get out of it

Performance

Links that close at full rate with margin to spare — verified, not assumed, across temperature and process.

Time-to-market

A specialist board team that productizes the newest silicon fast, so you skip building one in-house.

Total cost of ownership

Serviceable, instrumented, standards-compliant hardware that stays deployable across silicon generations.